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IEEE Computer Society, Technical Committee on Multiple-Valued Logic

ISMVL 2018 held in Linz, Austria  ISMVL 2017 held in Nobi Sad, Serbia 
ISMVL 2016 held in Sapporo, Japan  ISMVL 2015 held in Waterloo, Canada  ISMVL 2014 held in Bremen, Germany

Technical Committee on Multiple-Valued Logic


The Technical Committee on Multiple-Valued Logic (TCMVL) of the IEEE Computer Society promotes research in the theory and application of many-valued systems. Its scope includes Multiple-Valued Logic devices and circuits, algebra and formal aspects, fuzzy systems and soft computing, quantum and reversible computing, philosohpical aspects, spectral techniques, and related topics.

Call for Papers

The TCMVL sponsors a symposium each May, the International Symposium on Multiple-Valued Logic (ISMVL) and cosponsors the annual Post-Binary ULSI Systems Workshop. Many TCMVL members also attend the biennial Reed-Muller Workshop and International Workshop on Reversible Computing that focuses on topics of interest to the TCMVL community. TCMVL members also publish papers in the IEEE Transactions and the Journal of Multiple-Valued Logic and Soft Computing. The TCMVL maintains a mailing list of all members and sends newsletters to members.

Multiple-Valued Logic TC Chair:

Prof. Dr. Robert Wille

Institute for Integrated Circuits
Johannes Kepler University Linz
Altenberger Straße 69
4040 Linz, Austria
Email: robert.wille{at}

Related Links:

the Journal of Multiple-Valued Logic and Soft Computing

Japan Research Group of Multiple-Valued Logic

» Call for papers for ISMVL 2019 was added to page of Upcoming Events on July 13, 2018.

» The site for ISMVL 2019 Paper Submission was open on July 12, 2018.

» Executive Committee was renewed on May 9, 2018.

» The website was renewed on June 17, 2016.